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Electronic Packaging and Interconnection Handbook By Charles A. Harper
Download Ebook Electronic Packaging and Interconnection Handbook By Charles A. Harper
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- Sales Rank: #1178384 in Books
- Published on: 2000-02-18
- Original language: English
- Number of items: 1
- Dimensions: 9.30" h x 2.40" w x 6.30" l,
- Binding: Hardcover
- 992 pages
Review
Intended for electronic engineers, this handbook descibes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. (Sci-Tech Book News 20041201)
From the Back Cover
Electronic Packaging & Interconnection Handbook Widely regarded as the definitive resource in the field, Electronic Packaging & Interconnection Handbook, now in a thoroughly revised Second Edition, features over 50% all-new information, plus updated material on other major developments in high-performance packaging. Here is the latest practical insight into such vital new areas as advanced single and multichip packaging, ball grid array, flip chip packaging, chip scale packaging, and packaging microwave, high-speed and high-voltage electronics, in addition to cutting-edge analysis of advances in surface mount and soldering technologies. Distinguised specialists come together to cover all the fundamentals-from design to testing-as well as all connector and interconnection technologies and all types of electronics systems, providing-for the first time in any book-and integrated set of data and guidelines for packagers to use. Relying on the Handbook, practitioners will be better able to: optimize the mechanical and thermal design of electronic packages; Select the highest-yield, lowest-cost manufacturing processes, materials, and controls; Develop new markets for existing products; Create new products for emerging electronics systems. Featuring more than 600 illustrations, the Second Edition of this benchmark tool will be indispensible in assuring the development of more reliable, more manufacturable, and more cost-effective electronic packages and, finally, systems.
About the Author
Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronocs industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
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